Ceramic Processing

Is available for precision cutting of a wide variety of materials, including mineralogical sections, embedded tissue, teeth, bone, semiconductors and other embedded devices.A vertical precision diamond wire saw can cut virtually any type of material, using its unique diamond impregnated wire. It is ideally suited for cutting and slicing fragile materials including intermetallic crystal structures, semiconductor substrates with multiple layers, delicate electronic components and items which would be damaged using other methods of cutting. Also available in the range is a hard metal medium duty, bench top abrasive wheel cutting machine ideal for sectioning ferrous and non-ferrous materials prior to metallographic specimen preparation.


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